Electronics Forum: pad and clearance (Page 8 of 39)

Pad and Stencil Design

Electronics Forum | Mon Sep 17 17:49:02 EDT 2001 | arzu

What about the material of the stencil? Nickel formed? stainless steel? even more materials are available, some with different ways to form the apetertures.

Pad and Stencil Design

Electronics Forum | Sat Feb 09 17:33:30 EST 2002 | George Verboven

For more info about Metal Stencil Overview. also look at: http://www.tkb-4u.com/articles/printing/metalstenciloverview/metalstenciloverview.php

BGA lands and ICT

Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef

Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.

0201 and uBGA

Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef

Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?

0201 and uBGA

Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch

Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan

Pad and Component Dimensions

Electronics Forum | Tue Jun 03 01:50:10 EDT 2003 | jedduan

Hi Evtimov, You can get some information from IPC-SM-782A. Good luck! jed

Pad and Component Dimensions

Electronics Forum | Thu Jun 05 17:30:10 EDT 2003 | abarbe

Hi, Take a look a this site.Lot of information. http://www.pcbstandards.com/SiteIndex2.php

Lead Free and ICT

Electronics Forum | Wed May 10 00:46:32 EDT 2006 | Chris

I agree! I am using a SAC305 no clean from Alpha. I have noticed that even hand probing with volt meter leads requires me to press very hard on the pads to bust through the flux residue.

Gold and Palladium Plating

Electronics Forum | Fri May 17 05:12:51 EDT 2013 | ultimatejoker

What is the disadvantage of palladium plating instead of gold plating? I saw many advantage of palladium plating in term of hardness, wear resistance, and price but why most of the PCB Industries still use gold in PCB pad? Thank you

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a


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