Electronics Forum | Mon Jun 28 10:17:44 EDT 2004 | davef
People like flat surfaces for placing and reflowing certain components, like fine pitch devices. Some board suppliers can supply HASL that is flat and well controlled from an amount of material stand-point. Unlike OSP, HASL has a wonderful shelf-li
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Tue Dec 15 22:23:52 EST 1998 | Erhan Kaya
If that's what you mean, here's what we call them: ROBBER PADS... Pretty close to the "thief" I guess. Those come with the design and if the wave soldering direction is not known at the time of design and/or there's no real estate limitation, the rob
Electronics Forum | Tue Oct 30 19:42:44 EST 2001 | davef
Jim Blankenhorn [www.smtplus.com] has the best understanding of designing pads for real life. That�s because he designs them like he wants to design them and doesn�t negotiate with a committee of thousands for an IPC standard. Consider doing this
Electronics Forum | Fri Jun 11 06:06:41 EDT 2004 | davef
Have your designer place the via on the edge of the pad, centered and cover it with soldermask. If this is a leadless capacitor or resistor-style component, the corresponding pads will need to partially covered with solder mask to match the via in p
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny
When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b
Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul
I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.
Electronics Forum | Thu Apr 17 13:37:11 EDT 2014 | anvil1021
Hello All....we have several hundred PCBs that we need to run with a no-clean solder process and the surface finish is OSP. Our preliminary testing has found that the solder will not wet the entire pad even if the pad is over printed? We have contact
Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao
Thank you very much!
