Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef
For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It
Electronics Forum | Tue Feb 27 20:53:10 EST 2007 | davef
We'll guarantee the two pads are too close together. The proper spacing depends on the orientation of the parts to the wave. * Do the pads hit the wave at the same time? * Does one pad hit the wave before the other? If so, which? * How does the 06
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Mon Oct 09 06:16:31 EDT 2017 | jamesbarnhart
I think you needed an IPC Class 3 annular ring because for very dense designs, the smaller the annular ring the better, as less space is taken by the pad or via and more space can be dedicated to routing the traces in highly populated areas of the bo
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Thu Apr 08 19:32:52 EDT 1999 | Tom Reilly
FYI, Yes, it is true SMT Plus [ http://www.smtplus.com/ ]does not meet IPC 782 standards but is that the goal here or to meet IPC-A-610 standards for manufacturing? I agree that patterns do cause some problems if created to maximum IPC standards but
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
