Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry News | 2010-01-19 05:29:53.0
PROCAM - Automatic Gerber to Centroid (CAD) Extraction Software
Industry News | 2009-12-07 18:06:10.0
CyberOptics Limited will demonstrate the most comprehensive inspection platform at Productronica. The exhibition will see them unveil the brand new QX500 AOI system alongside the newly launched SE500 and SE500-X 3-D Solder Paste Inspection Systems and the latest innovation in Flex HR AOI software. Visitors are invited to join Cyberoptics in Hall A2, Stand 417 for the ‘complete’ inspection experience, scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-01-24 17:10:37.0
Viscom today announced plans to exhibit at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Calif. Constantly at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II and X7056-II 3D X-ray inspection systems, along with the S3088 ultra gold, S3088 ultra chrome and S3088 SPI in Booth #1508.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2017-10-12 15:01:31.0
Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.
Industry News | 2013-01-17 16:15:15.0
PARMI will exhibit in booth #1527 at the IPC APEX EXPO.
Industry News | 2013-02-25 16:05:16.0
PARMI announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series.
Industry News | 2011-05-12 22:13:47.0
Nordson DAGE showcased its newly developed 4000Plus pad cratering inspection system at Nepcon Shanghai.
Industry News | 2009-12-07 18:55:54.0
Solothurn, Switzerland - October2009 - JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, Flexible Mounters, Intelligent feeders and Software in Hall A3, Stand 143 of the Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.