Electronics Forum | Thu Aug 17 08:44:14 EDT 2000 | Wolfgang Busko
Hi Jaqueline, my first thought goes into the same direction, twist or warp (either the board or the BGA itself). I don�t know the SRT equipment. I�ve noticed with our equipment using a spot underheat element caused some warpage of the PCB making it
Electronics Forum | Sat Jan 14 06:38:04 EST 2006 | DannyJ
Hi Ken, Good question, and I did search for what you are asking, but unable to find anything conclusive about using tacky flux vs. solder. In reliability, it depends on which section of the process you are talking about. Mainly (and there are sev
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Fri Aug 30 11:17:19 EDT 2013 | jth
Hi, the BGA and/or the PCB may be warping excessively during reflow. We offer testing services to measure warpage of BGAs and PCBs during reflow to JEDEC and IPC standards. Let me know if you'd like to learn more about our services: joe@zntechnolo
Electronics Forum | Thu Feb 25 22:01:52 EST 1999 | Chris G.
| Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Tue Jul 20 14:17:34 EDT 1999 | Curtis
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Mon Jun 14 12:11:54 EDT 1999 | Earl Moon
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Thu Jun 08 22:54:31 EDT 2006 | hunghung
Dear all, If a PCB board, 2 mils of core with 1oz copper at the top and bottom, is it a good board to be fabricated? will it be caused warpage during etching for inner layer process? if yes, what is the real factor caused to warpage? How to solve t
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
winsouce.jpg)