Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown
Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications
Electronics Forum | Tue Jan 20 06:38:06 EST 1998 | Igmar
Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this com
Electronics Forum | Tue Jun 26 21:36:48 EDT 2007 | davef
While your peak temperature measurement is probably correct, you probably ripped the pads from the board long before reaching that temperature. By using a steep temperature ramp, you are causing the corners of the BGA to curl away from the board and
Electronics Forum | Wed Mar 16 20:12:12 EST 2005 | bkd
Does anyone knows any vendors that supplies jedec precondition tray that could stand up to 270�C peak reflow temperature.
Electronics Forum | Thu Sep 08 14:25:20 EDT 2005 | kris
what did you reprofile to ? did you increase the peak reflow temperature ? can you tell form what to where ? I bet your vendor told you process guys that it was " drop in" for a tin leaded plated part.
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Mon Feb 27 05:58:57 EST 2006 | Rob
Chunks is right, in the main the termination material is the only change. However, plastics have changed & the ones free of nasty chemicals (polybrominated whatevers)are actually less temperature tolerant. Also some manufacturers do publish PBT (pe
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
Electronics Forum | Tue Mar 27 07:34:57 EDT 2007 | ck_the_flip
Amy, One way you can drastically lower the peak temperature of your QFP and prevent it from re-melting is to lower the solder pot temperature. If you're running 63/37 in your pot, the typical range for these is 460�F to around 500�F. You will need
Electronics Forum | Wed Oct 19 22:48:18 EDT 2016 | thaneshsivanadian
Hi All, Currently im seeing a cold solder/ poor wetting underneath the BGA Ball as i shown in the attachment. From the attachment you also can see one ball with poor wetting and another ball with a good wetting. When i checked with my re-flow profil
