New SMT Equipment: peelable solder mask (Page 8 of 25)

4L-ENIG-PCB

4L-ENIG-PCB

New Equipment |  

FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test

Shenzhen Longkun Technology Co.,Ltd

6-layer-Carbon-Ink-PCB

6-layer-Carbon-Ink-PCB

New Equipment |  

High Tg FR4 Material 2.0 mm Thickness 6 Layers Immersion Gold Surface Treatment Green Solder Mask Carbon Ink

Shenzhen Longkun Technology Co.,Ltd

Rigid PCB

Rigid PCB

New Equipment | Materials

Multilayer PCB with Immersion Gold surface treatment; black solder mask

Shenzhen Sophic Industrial Co.,Ltd

8-layer PCB with impedance control

8-layer PCB with impedance control

New Equipment | Other

8-layer PCB with impedance control. Surface Finish: Immersion Gold

Pinsheng Group Ltd.

Module assembly

Module assembly

New Equipment | Assembly Services

This is 4 layer PCB with black solder mask,with half hole plating ,it is a module .we offer turnkey service for this job and function testing as well. see more details,pls click www.stormcircuit.com

Storm Circuit Technology Ltd

Wave Solder Pallets

Wave Solder Pallets

New Equipment | Board Handling - Pallets,Carriers,Fixtures

* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)

Shenzhen Sunshine Laser Technology

GC-PowerStation - Full CAM Package for PCB Fabrication

GC-PowerStation - Full CAM Package for PCB Fabrication

New Equipment | Software

Design For Manufacturability And Yield Enhancement. The Design for Manufacturability (DFM) engine searches for fabrication issues and discovers areas where yields may be increased. GraphiCode's Contour Technology produces fast and accurate results f

Graphicode

Printed Circuit Board

Printed Circuit Board

New Equipment | Test Equipment

Printed Circuit Boards(PCBs) are used to electrically connect electronic components using conductive pathways, traces, etched from copper sheets laminated onto a non-conductive substrate. Our manufacturing processes utilise the latest techniques an

CMD Circuits co., Ltd

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

2 Layer CEM-3 pcb

2 Layer CEM-3 pcb

New Equipment | Components

Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F

Headpcb


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