Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Thu Aug 28 11:07:34 EDT 2008 | saaitk
Can anyone please help me out. I am having solderability issues on a 208 pin QFP. I believe that it may be due to the age of the component. The date code states week 50 of 2003 which is not all that far off 5 years. The component was vacuum sealed at
Electronics Forum | Mon Aug 07 13:27:40 EDT 2017 | dleeper
Are you seeing this on bare PCBs or after assembly? with Immersion silver, the finish over the copper should be very thin and uniform, that's the main advantage of ImAg. You should not be seeing excess plating filling vias unless: A)Its HASL, not
Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum
We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Sat Sep 09 08:21:36 EDT 2000 | Sal
guys Currently experienced this problem on a product which had been running satifactorily for a period of time. No process changes were made, The problem was highlighted when after ICT when the boards were loaded in to the stress chamber, after the
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Fri Apr 25 04:44:56 EDT 2008 | jkhiew
Hi all, I mean after post adhesive oven curing (SMD at bottom side) prior to manual insert of PTH components (top side), what is the recommended storage time prior to wave soldering in order to avoid pin/blow holes and sunken joints issues (pcb asse
Electronics Forum | Tue Aug 23 16:48:29 EDT 2011 | jax
assuming Sn05Pb93.5Ag1.5 Without knowing what you are trying to solder, PTH or SMT, the time might not be that far off. Does that time include stripping, cleaning, plating the leads prior to soldering onto the board?... pre-tinning the board as well
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
