Full Site - : pin to pad defects (Page 8 of 32)

SHENMAO America to Solve Solder Paste Problems at APEX

Industry News | 2018-01-24 20:47:58.0

SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.

Shenmao Technology Inc.

Acculogic to Highlight Leading Testing Technologies at SMTAI 2010

Industry News | 2010-10-04 17:08:09.0

Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that it will highlight its leading testing technologies in booth 635 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Acculogic Inc.

Acculogic to Feature Latest Testing Technologies at APEX 2010

Industry News | 2010-03-24 22:00:27.0

WOBURN, MA - Acculogic's Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that it will feature the latest testing technologies booth 249 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Acculogic Inc.

Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo

Industry News | 2012-01-21 16:28:10.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012

Industry News | 2012-07-10 11:27:53.0

Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.

Nihon Superior Co., Ltd.

Digitaltest Brings Latest Hardware and Software Solutions to Apex 2011

Industry News | 2011-03-21 12:08:06.0

At Apex 2011 Expo in Las Vegas, Digitaltest Inc., a leader in electronic test hardware and software solutions for assembled printed circuit boards, will showcase its latest solutions in manufacturing and test technologies.

Digitaltest Inc.

Europlacer to Debut XPii Pick-and-Place Unit at Productronica 2009

Industry News | 2009-12-07 21:06:36.0

MARKHAM, ONTARIO ? October 2009 ? Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that it will highlight the InCircuit Scorpion iCT7000™, a new addition to Acculogic's family of in-circuit test (ICT) systems, in Hall A1, Stand 465 at the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.

Acculogic Inc.

SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2013 in Nuremberg

Industry News | 2013-03-18 10:28:43.0

SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

SEHO Systems GmbH

Basic Soldering Guide – How to Solder Electronic Components

Industry News | 2018-12-08 03:25:54.0

Basic Soldering Guide – How to Solder Electronic Components

Flason Electronic Co.,limited

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix


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