Electronics Forum: plated through hole is (Page 8 of 27)

haloing on SMT PCBs

Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond

I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of

Question about solder masking BGA vias...

Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef

The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.

IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet

Water soluble flux

Electronics Forum | Tue Oct 22 14:57:18 EDT 2002 | Jim M.

I use a water soluble flux to solder an LCD into gold plated through holes of a .031 circuit card. Problem is the current water soluble flux (850-33) is not made anymore (the drop in replacement has a different formuala and does not work). The main i

PIHR Inspection Criteria

Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis

Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just

Suspected Pink Ring

Electronics Forum | Tue Jul 27 11:59:19 EDT 1999 | Wolfgang Busko

While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would m

Re: Outgassing in Wavesoldering

Electronics Forum | Sat Jun 13 11:00:21 EDT 1998 | Earl Moon

| We are very concerned about outgassing in wavesoldering. | If anyone knows how to use properly well pcb's before soldering in order to avoid this problem please let me know. I have this problem in FR4 large double sided pcb's. My soldering line is

In your experience, do your customers care....

Electronics Forum | Thu Mar 13 16:37:48 EDT 2008 | darburch

The only time the customer is going to care about the standards is when it costs them money. Unsophisticated customers will continue the practice of providing little or no useful information, poorly designed boards and ridiculous mods until there is

Manual soldering - solder wire diameter and soldering iron tip size for different component sizes

Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais

We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size

Plating Thickness at Via Hole

Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef

When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a


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