Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
The MVP approach to 3D AOI utilizes the combination of both 2D and 3D AOI technologies bringing the advantages of high speed and superior defect coverage for complex defects. MVP’s advanced software tools are the key to taking advantage of each of th
Used SMT Equipment | AOI / Automated Optical Inspection
MVP (Machine Vision Products) 1820 Supra AOI Model: AutoInspector 1820 Supra - Automatic Optical Inspection Year: 2004 S/N: 2038 - Camera High-Res acquisition module - Large format quad speed JAI camera - Quad-angle light for 2D paste, pre-ref
Used SMT Equipment | AOI / Automated Optical Inspection
CyberOptics FLEX ULTRA (2010) High Resolution Automated Optical Inspection Machine Brand: CyberOptics Model: FLEX ULTRA Year: 2010 Serial: 70246 Type: Automated Optical Inspection Machine Product details: The new Flex Ultra HR is the latest
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
The VT-S730 is a High Quality Inspection system, meeting the needs of all SMT Processes. 3D-SJI: Unique COMBO patented technology RGB/Phase Shift IPC standard compliance in full real 3D Telecentric Camera Lens Multi-Angled, Oblique Cameras Use
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