11480 process results

Electronics Forum: process (Page 8 of 1148)

lead free process

Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao

We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are

lead free process

Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao

Re: SMT process benchmarks??

Electronics Forum | Fri Jun 12 13:05:55 EDT 1998 | Dew Lolly

Earl, You never miss an opportunity to muddy the water do you? ;-)

BGA process requirements

Electronics Forum | Fri Apr 12 08:40:13 EDT 2002 | Alan

Steve, I have done BGA work with and with-out Xray. If you are going to install them in high volume it makes sence to have every thing including rework on site. If you are just going to put down several a week you can probably get away without th

BGA process requirements

Electronics Forum | Tue Apr 16 06:29:16 EDT 2002 | Matt Kehoe

Have you considered Solid Solder Deposition? www.sipad.net mk

compactflash memory process requirements

Electronics Forum | Sun Apr 21 19:56:57 EDT 2002 | francis khoo

Hello Pete, Very true about the heel fillet. Looks like the pad at pcb has to be designed such that the pad should extend at heel but short at toe. About the encapsulation. I can understand the requirements. Can you provide me with a more detail proc

Print process capability

Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny

Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu