Electronics Forum: profile qsv1 plus (Page 8 of 12)

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean

| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 10:21:06 EDT 1999 | Earl Moon

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: Process Change

Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Re: Process Change

Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change

Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Process Change

Electronics Forum | Thu Jun 03 13:00:16 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 14:06:16 EDT 1999 | Dave F

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 15:19:14 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Process Change

Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W

Re: Process Change

Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W


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