Electronics Forum | Fri Jul 27 08:49:35 EDT 2007 | cman
We are currently have failures on one of our QFN > components. We are running this product with > lead free paste, lead free boards and lead free > parts. They have done a pull test on this > component and it showed that the solder joint > mai
Electronics Forum | Fri Jan 15 08:09:56 EST 1999 | Jason Hall
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Mon Aug 09 16:37:14 EDT 1999 | John Thorup
| Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, an
Electronics Forum | Wed Nov 14 10:51:34 EST 2007 | mumtaz
Yes. Baking boards is best. Hitting the hamer on the head!
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Tue Nov 13 12:25:12 EST 2007 | gradloff
I have a thick board with ground planes that will be soldered by hand with a mildly active solder/flux. X-ray confirmed that solder was added to the top of the joint causing a void between the bottom and top solder joint. Other than the mildly acti
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
