Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt
Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.
Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
Electronics Forum | Thu Jul 14 11:52:16 EDT 2005 | davef
Sure you can use SPC charting on the wave setup parameters to warn of impending problems. Examples of useful points of analysis are: * Dwell * Temperature * Pot analysis Certainly there's a range of other process controls that could be monitored.
Electronics Forum | Fri Jul 15 10:56:19 EDT 2005 | pr
As Russ said, you do a DOE beforehand. BUT Maybe we are missing something, we do SPC after the wave (1/5) to catch defect trends and fix them with a minimum of inspection. If you are running a 2,000 piece pull, are you that confident that your origin
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Thu Jun 01 04:51:21 EDT 2006 | EC
Hi TS, Most of the machines will face this problem after been using few years.....I handling SMT equipments ( Fuji machine ) and process.....sorry if I have offened you...... Hi Jack, Firstly, you must able to tell which component having a high thr
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval
We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww
Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer
| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!
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