Thermal Profiler for reflow oven Accuracy: ±1 ℃ sampling number: 12000 internal protection temperature: up to 70 ℃ for 5 minutes Temperature range: 0-500 ℃ Product description: Thermal Profiler for reflow oven INQUIRY Therm
Thermal Profiler for reflow oven Accuracy: ±1 ℃ sampling number: 12000 internal protection temperature: up to 70 ℃ for 5 minutes Temperature range: 0-500 ℃ Product description: Thermal Profiler for reflow oven,Accuracy: ±1 ℃,sampl
New Equipment | Test Equipment
Thermal Profiler for reflow oven Accuracy: ±1 ℃ sampling number: 12000 internal protection temperature: up to 70 ℃ for 5 minutes Temperature range: 0-500 ℃ Product description: Thermal Profiler for reflow oven INQUIRY Thermal Profiler
Industry News | 2018-10-18 09:42:39.0
SMT reflow oven process principle and introduction
A��Intuitional welding control: TN360C adopts advanced furnace temperature collection system. It can test temperature curve and temperature in furnace hearth. The temperature curve can be recorded or printed at the same time�� B��Smooth and safe tran
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
RF8810 High Precision SMT Reflow Oven - Professional Reflow Soldering Machines Characteristics: 1.Competitive price for quality 2. Eight years manufacturing experience 3.True Leader of Smt machines manufacturer in China Leadsmt the mainstream man
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
Industry News | 2019-12-16 22:38:22.0
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Industry News | 2019-12-16 22:31:09.0
Vacuum reflow solder is refers to the vacuum eutectic oven, vacuum in vacuum environment for high quality welding products, in the welding process of zhongtong into reducing system (N2, formic acid, N2H2, H2), to protect the product and the solder is not oxidized, at the same time the product and solder oxide on the surface of the reaction, make weld surface quality improvement, reduced the rate of welding hollow.
