All electronic hardware is susceptible to the damaging effects of moisture, temperature, and contaminants. STI understands the criticality of reliability testing and test-to-failure. Improper selection of assembly materials and manufacturing processe
New Equipment | Design Services
Engineers at STI are available to perform a design feasibility assessment as you begin developing the standards your next product or revision upgrade. Our design engineers will provide objective feedback on key design issues such as functional requir
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Industry Directory | Consultant / Service Provider
At CSZ, we test products for a variety of industries and applications such as automotive testing,electronics testing, mil-std testing, battery testing, package testing, solar panel testing and more.
Industry Directory | Consultant / Service Provider
CSZ Testing Services is your single source for product testing and process evaluation. Let us know what you need tested and we will get back to you very quickly with a solution for you.
New Equipment | Solder Materials
AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resista
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer Rockwell Automation Part Number/Catalog No. 1785-L30B Brand Allen-Bradley Non-Ope
Industry News | 2013-11-01 13:11:17.0
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
(Albany, NY) March 26, 2023 YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product: Thermal Underfill - UF 158A2. Designed for use in a variety of electronic devices, not
