Electronics Forum: reporter (Page 8 of 86)

Managing Production Schedules

Electronics Forum | Thu Jul 18 08:14:25 EDT 2002 | CAN

Does your company use an MRP system? If so you should be able to print a report that defines assembly due dates as well as the time it takes to process each assembly. What I do is print the report at the begining of the week for everyone to work from

Oxygen Levels in Lead-Free Reflow

Electronics Forum | Wed Oct 16 18:54:36 EDT 2002 | davef

There is not requirement for a low O2 atmosphere for no-lead soldering. There was quite a lot of work on lead-free profiles in the European IDEALS lead-free project and some info on this is available for download at: * http://www.lead-free.org/down

Contract manufactuer in China

Electronics Forum | Thu Feb 19 22:01:51 EST 2004 | fastek

I've published my own strategic new market research report you may find of interest titled, "Electronics Manufacturing in China, Final Edition". It's free by the way: "U.S. production of contract assemblies in 2000 is $X. China production of cont

Manufacturing faults - data collection systems

Electronics Forum | Wed Apr 14 10:58:12 EDT 2004 | heatherc

Aegis software offers an MES system that offers both automated and manual data collection points. All of the data collected is automatically deposited in one central database. This database is then used for generating all of the SPC reports for ana

Immersion Silver Reliability

Electronics Forum | Tue May 25 10:16:03 EDT 2004 | Bimal Patel

We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have

Immersion Silver Reliability

Electronics Forum | Tue May 25 10:16:07 EDT 2004 | Bimal Patel

We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 13:02:49 EDT 2006 | grantp

Hi, That was another very interesting article posted. This article seems to point to the same conclusion, which is that lead free soldering is more reliable than Pb components with Pb paste, and Lead Free components with Pb paste? From what I see,

SMT FEEDER SETUP

Electronics Forum | Wed May 09 12:14:08 EDT 2007 | mmjm_1099

I am wondering if anyone has tried to run a crystal report out of Fuji Flexa? What I would like to do is run the report that make a default feeder list for that certian day to minimize feeder setup times. So please leave me some feedback if you have

Touch-up, Inspection, Rework

Electronics Forum | Wed Jul 09 12:43:18 EDT 2008 | grics

I think this depends on what you are reporting as defects... I would place my inspection first, team up my Touch-up/Rework into one category. If for any reason I need to hit a joint after leaving my oven, that to me is classified as a defect and s

ENIG CONTAMINATION

Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat

I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif


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