Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Fri Dec 15 14:31:43 EST 2006 | MFG CAVEMAN
John, Search the archives for lead free BGA and you should find plenty of info.
Electronics Forum | Fri Dec 15 09:44:38 EST 2006 | mashmo
Hello I am a circuit board designer and just wanted to ask if anyone is seeing the need to alter footprints for ROHS assembly. I also wanted to make sure that I have this particular issue correct. If your BGA is lead free then used solder paste with
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister
Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and
Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424
I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of
Electronics Forum | Tue Jun 20 19:15:19 EDT 2006 | grantp
Hi, What are your thoughts about the article saying that the lead will leach out of the solder joint to the last place to cool, creating a weak point? I have two worries about the report. First, is that we have always used tin lead solder, and le
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika
Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib
