Electronics Forum: rohs bga (Page 8 of 13)

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95

I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t

New to ROHS

Electronics Forum | Fri Dec 15 14:31:43 EST 2006 | MFG CAVEMAN

John, Search the archives for lead free BGA and you should find plenty of info.

New to ROHS

Electronics Forum | Fri Dec 15 09:44:38 EST 2006 | mashmo

Hello I am a circuit board designer and just wanted to ask if anyone is seeing the need to alter footprints for ROHS assembly. I also wanted to make sure that I have this particular issue correct. If your BGA is lead free then used solder paste with

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane

Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold

pad cratering

Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm

hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu

BGA Voids

Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister

Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and

Lead-free BGA in Tin/Lead Process

Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424

I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Tue Jun 20 19:15:19 EDT 2006 | grantp

Hi, What are your thoughts about the article saying that the lead will leach out of the solder joint to the last place to cool, creating a weak point? I have two worries about the report. First, is that we have always used tin lead solder, and le

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir

Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika

Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib


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