Electronics Forum | Fri Oct 01 02:46:47 EDT 2021 | sn
Thanks, Evtimov. In terms of mechanical drop performance, can we conclude that the higher Ag alloy will have poorer drop shock performance relatively compare to those with lower Ag? The Ag3Sn is a good IMC for welding strength?
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Thu Oct 05 16:03:31 EDT 2006 | C.K. the Flip
I had horrible experiences with a certain brand on multiple types of BGA's (I choose not to mention the brand). The paste was nice and active, but almost to a fault when it came to BGA's. Finally, I arrived at a profile with a more agressive ramp u
Electronics Forum | Wed Oct 04 17:15:23 EDT 2006 | russ
that question I think I will punt it on over to some of the experts here. I really do not the "why". voids for me have always been related to the escape (lack of) of the "stuff" that is in the paste. I have seen diff pastes perform differently rel
Electronics Forum | Fri Oct 06 08:21:26 EDT 2006 | inds
Mario, what happens when there are components on the boards that are not rated to take temperature of 230-240 C Peak for a mixed assembly. I guess there are tons of sn/Pb components that have rated temp of 225-230 C.. So in guess you might want
Electronics Forum | Mon Jun 26 10:37:59 EDT 2006 | smt_guru
Jay---- Please contact me if you are interested in the new alloy that my firm, WCS, inc. has invented. Bahodim (TM) solder is successfully being used by a startup in Florida, Initech, inc. Bahodium has out-performed SAC, Tin-Lead and SN100 in re
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Tue May 13 07:47:06 EDT 2014 | sarason
What is the product for? If you share more information maybe there is another way of dealing with the issue, like removal of the joints by a different circuit design. sarason
Electronics Forum | Tue May 13 08:51:21 EDT 2014 | gazelle
What is the product for? If you share more > information maybe there is another way of dealing > with the issue, like removal of the joints by a > different circuit design. > > sarason Hello - it is a highly stable reference source - exactly 10
