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Process optimization -Lead free wave soldering of simple to highly complex boards Process optimization Lead free wave soldering of simple to highly complex boards This research takes an in-depth look at the challenges encountered
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SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
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