Electronics Forum: screen printing in vias (Page 8 of 10)

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Dbl-Sided Reflow Question

Electronics Forum | Fri Jun 02 09:31:26 EDT 2000 | C.K.

Okay, there's a debate here at my company. We build a card here that, often times, we get batches where there is excess HASL in the VIA hole barrels. Here is the problem that this causes: During the "1st reflow", the excess HASL bleeds out of the

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

Dispensible Conductor Material for Bare Board Rework

Electronics Forum | Mon Jan 22 11:50:07 EST 2007 | BWET

Can anyone recommend a material which can be used an a bare board: 1. Dispensed via a syringe 2. Mimmic the electrical characteristics of a trace 3. Be processed such that they do not reflow with the solder interconnect 4. Be processed such that the

SOLDERMASK SCREEN PRINTING

Electronics Forum | Tue Oct 19 13:20:40 EDT 2021 | davef

Info@Xpresscreen.com O: 336-722-2500 800-597-9530 F: 336-722-2575 xpresscreen.com/ Saati S.p.A., Via Milano, 14 22070 Appiano Gentile (CO) - Italy; O: +39 031.97.11 F: +39 031.933.392 info.it@saati.com">info.it@saati.com https://www.saati.com/

Tenting via(s) under BGA & CSP?

Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef

First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate

DEK pro-flow

Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)

Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony

| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi


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