Electronics Forum | Fri Jan 19 07:26:45 EST 2007 | Richard-magictek Tech
kindly send me your reflow profile ---and also the PCB lay out i shall able to determine your process flow on speed....and glue application i can be reach at this email- rdm@magictek.com.cn my web site is ;www.magictek.com.tw we are furance maker w
Electronics Forum | Wed Jun 20 19:52:47 EDT 2007 | davef
J-STD-001, 5.4 Solderability Maintenance states words to the effect "The manufacturer shall ensure that all components [bla bla bla] are solderable at the start of hand and/or machine soldering operations." So, how many you contractor cats 'n kittie
Electronics Forum | Mon Jul 23 09:43:50 EDT 2007 | pjc
From NASA document: Conformal coating thickness shall be determined using a wet film thickness gauge,....... Wet Thickness Gauges can be obtained: Wet film Thickness Gauge P/N 790010 Nordson Corp, Amherst, OH or http://www.nordson.com/cgi-bin/MsmG
Electronics Forum | Thu Sep 20 13:06:37 EDT 2007 | hussman
Acualy same supplier, but they have 7 different facilities. Changes in prepreg thickness from lot to lot is the big deal, since internal shorting occurs form time to time. Just wondering if there was a spec I could use to force them to use the same
Electronics Forum | Tue Oct 07 11:45:59 EDT 2008 | ismir
Hi all! Got a question for you guys:) I'd like to measure if the grayscale of an AXI is stable or not. How shall I do it? Should I do a process capability study or is the X-bar chart-method better? Or is there a third method that I should use? What
Electronics Forum | Mon Aug 30 14:32:52 EDT 2010 | davef
Steve: Yes, you shall bake prior to thermal cycling. You should be able to download J-033 from JEDEC [ http://www.jedec.org/standards-documents ]. You want "Paragraph 4 Drying." While it's aimed a component parts and not assemblies, J-033 is as goo
Electronics Forum | Mon Mar 07 12:23:05 EST 2011 | rogerk
Shean, One of my customer requested that their product shall be process utilizing no clean chemestries and washed utilizing appropriate saponifier and rised with DI water due to the high voltage of their assembly. I wanted to convince my customer
Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani
Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon
IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.
