Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Fri Jun 03 14:31:33 EDT 2005 | Peter
I am working on an application requiring removing BGAs from a board coated with parylene. These BGAs have low standoff with less than 0.015" after SMT soldering. Can some comment on a reliable and consistent process to perform such rework? given tha
Electronics Forum | Fri Apr 24 14:18:40 EDT 1998 | Scott Davies
I realize this is a SMT forum, but I have another problem related to electronics assembly and hope there will be someone out there that can save my life (this time). We build quite a few VME assemblies to which we attach a SAM board. Fairly standard
Electronics Forum | Mon Apr 27 06:46:39 EDT 1998 | Greg Curler
| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai
Electronics Forum | Thu Jul 03 15:03:39 EDT 2003 | Jim Nunns
My design group wants to change our route keep out around all SMT parts to 5 mil even under the parts with zero standoff. Are others in the industry routing under parts that have no standoff? My fear is that we will get shorting if the mask is scaped
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Mon Apr 27 11:04:12 EDT 1998 | Dave
| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai
Electronics Forum | Mon Apr 27 07:37:42 EDT 1998 | Scott Davies
| | I realize this is a SMT forum, but I have another | | problem related to electronics assembly and hope there | | will be someone out there that can save my life (this | | time). | | We build quite a few VME assemblies to which we attach | | a SA
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