Full Site - : sn100c sac305 mix (Page 8 of 29)

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Industry News | 2018-01-18 04:01:33.0

Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.

Balver Zinn

Cobar to Exhibit Water-Soluble LF3237 Solder Wire at SMTA Upper Midwest

Industry News | 2013-06-06 19:12:21.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN

Cobar Solder Products Inc.

The Balver Zinn Group Goes with LLE Soluciones & Repstronics to Guadalajara for the SMTA Mexico Expo & Tech Forum

Industry News | 2017-10-06 09:35:20.0

The Balver Zinn Group a leading global manufacturer of solder materials, announces that they will exhibit together with LLE Soluciones & Repstronics at the SMTA Mexico Expo & tech Forum. The SMTA Mexico Expo is scheduled to take place October 18-19, 2017 at the hotel Riu Plaza in Guadalajara, Mexico.

Balver Zinn

FCT Solder to Premier NC162 SN100C No-Clean Flux at APEX 2008

Industry News | 2008-03-12 16:35:20.0

GREELEY, CO � March 2008 � FCT Solder, a division of FCT Assembly, announces that it will introduce NC162 SN100C� No-Clean Flux in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

FCT ASSEMBLY, INC.

Nihon Superior’s Keith Howell to Present at International Conference on Soldering and Reliability

Industry News | 2010-05-05 21:42:51.0

OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.

Nihon Superior Co., Ltd.

Surfaces of mixed formulation solder alloys at melting

Technical Library | 2022-10-31 17:25:37.0

Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]

Auburn University

Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011

Industry News | 2011-04-07 20:43:37.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell, Technical Director, will present a paper titled "Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly" at the upcoming International Conference on Soldering & Reliability (ICSR).

Nihon Superior Co., Ltd.

The Balver Zinn Group to Debut OT2 Solder Paste and BRILLIANT B2012 Wire at Productronica

Industry News | 2013-10-08 14:47:36.0

The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Cobar Solder Products Inc.

Nihon Superior's Keith Sweatman to Present at APEX 2010

Industry News | 2010-03-30 14:09:38.0

OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.

Nihon Superior Co., Ltd.

Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International

Industry News | 2013-09-13 13:33:38.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Balver Zinn


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