Electronics Forum: sn62pb36ag2 and gold (Page 8 of 10)

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Wed Apr 06 12:21:14 EDT 2011 | ripper

Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Wed Apr 06 13:43:14 EDT 2011 | mosborne1

ENIG is the way you need to go. With ENIG you deposit a lot less gold. Too much gold will cause soler problems. Matt www.americancircuits.com

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko

Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio

PB and PB Free on same screen printer

Electronics Forum | Thu Oct 04 16:12:52 EDT 2007 | mike007

Use dedicated stencils & gold or green squeegee holders

Tinned leads and where the component body is defined

Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501

We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po

Lead Free PCB Plating and Leaded Solder Process

Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols

I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Thu Apr 07 02:38:20 EDT 2011 | aungthura

I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfor

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Thu Apr 07 09:04:19 EDT 2011 | mosborne1

First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture.


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