Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs
I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?
Electronics Forum | Mon Dec 03 03:58:24 EST 2018 | ameenullakhan
Hi , Observed component drop during second reflow. Component : Image attached Perimeter : 0.15 to 0.025 cm No of leads : 22 Solder Alloy : Sn63/Pb37 As per component adhesion calculation the component should not fall. ( Excel Attached ) Profile
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Tue Sep 13 02:51:35 EDT 2022 | sarason
Lead and tin form a eutectic solution. So no to that one, as to breaking some rule or other other people who are far more knowledgeable than me on "the rules" could pipe in. Also tin/lead eutectics don't grow tin whiskers like a lot of the replacemen
Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik
Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting
Electronics Forum | Wed Aug 04 18:57:26 EDT 1999 | Dreamsniper
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | Hi Judy, In profiling you need an understanding of the reflow specs from the solder paste manufacturer then you nee
Electronics Forum | Wed Aug 04 22:35:32 EDT 1999 | ScottM
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | D... is correct -- it's all dependent on your paste and your oven. Call your paste supplier (each one has a technica
Electronics Forum | Thu Jul 15 08:34:54 EDT 1999 | Mark Quealy
I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but humi
Electronics Forum | Tue Apr 13 08:08:33 EDT 1999 | Rob Palson
We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to bu
Electronics Forum | Mon Apr 19 02:38:41 EDT 1999 | Brian Sloth Bentzen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
