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Torch TP400V

Torch TP400V

Used SMT Equipment | Pick and Place/Feeders

Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision

Beijing Torch Co.,Ltd

Torch TP210

Torch TP210

Used SMT Equipment | Pick and Place/Feeders

Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos

Beijing Torch Co.,Ltd

Philips FCM Base II Chip Shooter

Philips FCM Base II Chip Shooter

Used SMT Equipment | Chipshooters / Chip Mounters

Product Details: Machine type: PA 1100/04 Technology Max, Body size: 0402 to SOIC20 Max Board Dim (Lenght x width): 460/50 mm x 460/50 mm tact time: .072 seconds Components/Hr: 50,000 Operating System: IBM OS/2 Version 3.00 Software Version: 5.21

Tekmart International Inc.

MiniATE Systems Pvt. Ltd.

Industry Directory | Manufacturer's Representative

MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.

minitype automatic mounterTP45N

minitype automatic mounterTP45N

New Equipment |  

TP45N can release all SMD units including 0201 ,SOIC PLCC BGA to QFPIC(o.5mm foot spacing) ��Automatic centering system: The 4 side claws can fit for all SMD component like 0402, SOIC, PLCC��QFP IC�� ��High precision pole system ��Vision centering s

Beijing Technology Company

Tape and Reel Capabilities

New Equipment |  

Chips, SOIC's, SSOP's, SOJ's, PLCC's, BGA's, socket's, QFP's, Odd form devices, connectors, switches and any custom components.

Advanced Component Packaging

Memory Products

Memory Products

New Equipment |  

High-density SRAM, Flash, EEPROM, and DRAM in BGA, QFP, SIMM, DIMM, PLCC, flatpack, ZIP, SOIC, DIP, and other packages. PC Cards. High-reliability packaging for extreme environments and military applications.

White Electronic Designs Corp.

Discontinued semiconductor packaging

New Equipment |  

Packaging of discontinued semiconductor devices (when die are available)in all packaging styles such as DIP, SIP, SOIC, SMT, etc.

EMS Microelectronics Division

Test Vehicle PC Boards

Test Vehicle PC Boards

New Equipment | Components

100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available.

TopLine Dummy Components

Programming Adapters

Programming Adapters

New Equipment |  

Accept a surface mount package and plug into a DIP socket on an EPROM programmer. Available for DIP, PLCC, QFP, SOIC, SSOP, TSOP, TSSOP and QSOP

Logical Systems Corp


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ISVI High Resolution Fast Speed Industrial Cameras

High Throughput Reflow Oven
SMT feeders

High Precision Fluid Dispensers
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