Electronics Forum | Sat Jan 29 05:43:51 EST 2005 | Chua
Hi Chunks, Thanks for your input. Appreciate you could send me a copy of your evaluation list as this type of evaluation is new to me..... Here is my email address :- pgchua@cyberway.com.sg Thanks.
Electronics Forum | Tue Feb 01 20:08:39 EST 2005 | davef
Look here: http://www.epa.gov/ozone/snap/icel/noclean2.pdf
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Tue Feb 01 09:53:37 EST 2005 | Howard Sommerfeld
I also have a spreadsheet tool for comparative analysis using criterion weighted scoring. It can be used to analyze any decision, and helps groups reach consensus on why a particular alternative is the way to go. As final steps you can also consider
Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew
For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ
Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks
Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
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