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How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

SMT Lead Free Wave Soldering Machine XMW-350

SMT Lead Free Wave Soldering Machine XMW-350

New Equipment | Reflow

SMT Lead Free Wave Soldering Machine XMW-350 Wave soldering advantages: ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes. Intelligent: intelligent control software, memory process parameters

Qinyi Electronics Co.,Ltd

Preparation for Reflow Profiling

Technical Library | 2019-05-24 09:22:59.0

There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.

ACI Technologies, Inc.

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

BGA Rework Station,  Model SV530

BGA Rework Station, Model SV530

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! Easy placement and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMD's using this BGA Rework Station with color optical system that h

Precision PCB Services, Inc

Fuji Ahrg1350 FUJI Gl2 Gl5 Gl541 1.0 0.7 1d1s IC Needle

Fuji Ahrg1350 FUJI Gl2 Gl5 Gl541 1.0 0.7 1d1s IC Needle

Parts & Supplies | Assembly Accessories

FUJI Nozzle in stock FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 0.7 / 1.0 / 1.3 / 1

KingFei SMT Tech

SMTA International Exhibition 2015 - Electronics Manufacturing

SMTA International Exhibition 2015 - Electronics Manufacturing

Videos

SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri

Surface Mount Technology Association (SMTA)

SMT Lead Free Wave Soldering Machine XMW-450

SMT Lead Free Wave Soldering Machine XMW-450

New Equipment | Reflow

SMT Lead Free Wave Soldering Machine XMW-450 Feature ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes Intelligent: intelligent control software, memory process parameters, automatic heating

Qinyi Electronics Co.,Ltd

DIP Double-side Camera Online AOI Machine ETA-V5300

DIP Double-side Camera Online AOI Machine ETA-V5300

Videos

DIP Double-side Camera Online AOI Machine ETA-V5300​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac

Dongguan Intercontinental Technology Co., Ltd.

Investigation of PCB Failure after SMT Manufacturing Process

Technical Library | 2019-10-21 09:58:50.0

An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).

ACI Technologies, Inc.


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