Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Industry News | 2019-06-02 18:40:27.0
SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2009-04-21 13:58:29.0
TORRANCE, CA � April 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Toronto Tabletop Exhibition, scheduled to take place May 20-21, 2009 at the Crowne Plaza in Toronto, ON.
Industry News | 2015-01-20 18:02:54.0
Metcal today announced plans to exhibit in Booth #627 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2015-01-22 11:45:39.0
Metcal today announced plans to exhibit in Booth #524 at MD&M West, scheduled to take place Feb. 10-12, 2015 at the Anaheim Convention Center in California. The award-winning Scorpion Rework System will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2015-03-17 16:10:02.0
Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time in Asia, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2015-07-21 08:12:52.0
Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON South China, scheduled to take place Aug. 25-27, 2015 at the Shenzhen Convention & Exhibition Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
