Electronics Forum | Fri Jul 10 13:58:49 EDT 1998 | Bob Willis
The parameters which effect the problem you are having are flux and contact time try first increasing the flux you are applying. Next reduce the contact time in the wave by adjusting the back flow plate. If the problem is a jig design check out the j
Electronics Forum | Thu Aug 13 13:35:38 EDT 1998 | Mike Cox
| I am looking for information on any Gage R&R studies for the CyberOptics LSM solder paste inspection system. If you are a current user of one of these systems, are you finding any problems with the repeatability due to operator variation? What is
Electronics Forum | Mon Dec 28 09:12:56 EST 2009 | kpm135
@tommyg_fla According to the TDS the recommended coating thickness for Humiseal 1B31 is only 1-3 mils so if I had to guess I would say your issue might be that you're re-coating over the first pass too soon. All the solvent hasn't evaporated and the
Electronics Forum | Tue Apr 09 00:26:46 EDT 2002 | craigj
Are currently investigating a change of solder paste for various reasons and are considering a move from 63/37 to using 2% silver solder paste for increased long term reliabilty of solder joints with gold finish PCBs and to further reduce reflow temp
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Fri Mar 13 17:09:49 EDT 2009 | kmorris
We have found very small solder deposits on the gold fingers of some PCI boards after assembly at our CM. In the IPC-A-610, it says that no contamination or solder is allowed in the critical contact area. 1. I'm looking for feedback on what others
Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef
First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
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