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C or more above the liquidus. If a solder joint needs to retain physical integrity during a later operation, such as a second reflow process, the peak temperature of the later operation needs to be below the solidus temperature of the alloy
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Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/solder-paste-inspection?con=t&page=2
Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
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: high to low Halogen Free Solder Paste $ 89.23 Add to cart High Reliability Alloy Solder Paste For ENIG $ 140.00 Add to cart JM-20 Sn60/Pb40
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/solder-paste-inspection?con=t&page=3
Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
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Information Solder Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
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