Electronics Forum | Mon Nov 30 21:56:31 EST 2020 | emeto
Did you try a ramp to spike profile? My thought is that you burn all your flux in your long soak and when the actual reflow happens, you have no flux activators working. Also will be interesting to see your profile and know more about the defects. Is
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH
Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t
Electronics Forum | Mon Jun 25 20:50:33 EDT 2001 | davef
If your solder paste has forsaken the pads and gone to all the work of climbing the leads, it�s because the leads are much warmer than the pads. Some like it hot!!! We talked about this on SMTnet within the past 6 months. Please check the archives
Electronics Forum | Thu Nov 05 17:39:21 EST 1998 | Dave F
| Is there anyone who can help me with the average profile to start and speed of the above-mentionned oven ? Have you used the blower at any other setting than 100% use? | Barbe: The first pass at setting your profile should be based on: 1 Sol
Electronics Forum | Wed Sep 25 10:56:27 EDT 2002 | xrayhipp
Yeah, perhaps lean more towards a ramp-to-spike profile - reducing the soak time and add a littel heat to your temp above liquid. This has worked for us with water soluable paste as we are not required to use no-clean and utilizing a 6-zone oven. G
Electronics Forum | Wed Jun 25 12:20:03 EDT 2003 | russ
This may make it easy, Do you really need soak? Or can you just ramp to reflow. Most pastes that I am aware of perform just as well using the linear ramp as opposed to the ramp/soak /spike. Now, out of curiosity how are you attaching the thermocou
Electronics Forum | Mon Mar 13 05:29:08 EST 2006 | hitechsc
Hi just to clear a few things, We produce the nozzles and the parts are manufactured in two stages, CIM and plastic injection moulded, we designed the rear end of the ceramic tip with spikes so when the secondary operation on plastic over mould the p
Electronics Forum | Tue Feb 22 07:19:51 EST 2005 | austinj
I have been profiling with the fixture. I have performed multiple DOE runs and came up with the following with success: Cooled soak zone to max 150C for approx 100sec. and spiked reflow zone for max temp of 230C, pcb/panel is above 183C for 64sec.
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
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