SAKI 3D AOI 3Di LS2 single lane AOI PCB size:50x60-330x330mm Dimension:1040x1440x1500mm weight:900KG Product description: SAKI 3D AOI 3Di LS2, Single lane AOI, PCB size:50x60-330x330mm, Dimension:1040x1440x1500mm, weight:900KG SAKI 3D AOI 3
New Equipment | Test Equipment
SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed， Resolution 10μm, Boa
New Equipment | Test Equipment
SAKI 2D AOI BF-Planet-X II Resolution 10μm Board size:330x250mm Dimension:600 × 915 × 1270mm, weight:Approx. 275kg Product description: SAKI 2D AOI BF-Planet-X II Smallest footprint, inline, high speed， Resolution 10μm, Bo
New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI RS-1R Pick and Place Machine modular chip mounter Applicabl
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI RS-1R Pick and Place Machine,Applicable Components: 0201~50
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI RS-1R Pick and Place Machine modular chip mounter Applicable Components
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI RS-1R Pick and Place Machine modular chip mounter Applicable Components
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
.gif)
