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Agilent 83624A

Agilent 83624A

Used SMT Equipment | In-Circuit Testers

Agilent 83624A Synthesized Sweeper, 2 to 20 GHz, High Power The Agilent 83624A synthesized sweeper is the standard of excellence for applications requiring the high performance and accuracy of a synthesized source and the speed and versatility

Test Equipment Connection

Agilent Agilent 83650B

Agilent Agilent 83650B

Used SMT Equipment | General Purpose Test & Measurement

Agilent 83650B Synthesized Swept-Signal Generator, 0.01 - 50 GHz The Agilent 83650B synthesized sweeper is the standard of excellence for applications requiring the high performance and accuracy of a synthesized source and the speed and versati

Test Equipment Connection

Agilent 8753ES -006-011 Network Analyzer

New Equipment | Test Equipment

The Agilent/HP 8753ES S-parameter vector network analyzer is a cost-effective solution for characterization of the RF components. The built-in transmission/reflection (T/R) test set has a full range of magnitude and phase measurements in the forwar

Recon Test Equipment Inc.

Vishay Intertechnology Thermawick DMD Thermal Jumper Chip Removes Heat from Electrically Isolated Components

Industry News | 2021-05-21 12:12:03.0

Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life

New Yorker Electronics

New development of atomic layer deposition: processes, methods and applications

Technical Library | 2020-09-08 16:43:32.0

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.

University of Johannesburg

Surfaces of mixed formulation solder alloys at melting

Technical Library | 2022-10-31 17:25:37.0

Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]

Auburn University

Agilent 8564E Spectrum Analyzers

Agilent 8564E Spectrum Analyzers

New Equipment | Test Equipment

The 8564E portable millimeter spectrum analyzer offers the measurement capability and performance previously found in larger, more expensive benchtop analyzers. You can measure signals from 30 Hz to 40 GHz (preselected above 2.75 GHz) with a single c

Test Equipment Connection

Anritsu S331B Cable Antenna Analyzers

Anritsu S331B Cable Antenna Analyzers

New Equipment | Test Equipment

Anritsu S331B Cable Antenna Analyzers The Anritsu S331B SiteMaster, with frequency coverage of 25 MHz to 3300 MHz, is ideally suited for users who work in VHF, broadcasting, paging, cellular, PCS/GSM and ISM and WLL frequency bands. Both S331B and

Test Equipment Connection

Agilent 8563E Spectrum Analyzers

Agilent 8563E Spectrum Analyzers

New Equipment | Test Equipment

The Agilent 8563E portable microwave spectrum analyzer offers the measurement capability and performance previously found in larger, more expensive benchtop analyzers. This analyzer has a standard frequency range of 9 kHz to 26.5 GHz (preselected fro

Test Equipment Connection

used equipment ,Agilent 8561E Portable Spectrum Analyzer, 30 Hz to 6.5 GHz

used equipment ,Agilent 8561E Portable Spectrum Analyzer, 30 Hz to 6.5 GHz

New Equipment | Test Equipment

Description The Agilent 8561E portable RF spectrum analyzer offers the measurement capability and performance previously found in larger, more expensive benchtop analyzers. This analyzer combines outstanding phase noise, sensitivity, 1 Hz resolution

Shenzhen jiahuijie technology Co,;Ltd


synthesize searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

High Precision Fluid Dispensers
Selective soldering solutions with Jade soldering machine

Wave Soldering 101 Training Course
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications