Electronics Forum: temp and chiller (Page 8 of 13)

Lead Free and Leaded Process Mix

Electronics Forum | Tue Jul 19 04:10:21 EDT 2005 | Rob

Hi, On a semi related front, part of our company is a distributor (I'm not going to say who, coz that would be sneaky advertising), and on all components shipped we've added the follwing to the label: ROHS Compliancy Status(Lead free & plastics etc

Required humidity for SMT production and storage

Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas

Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

Re: Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 19 20:49:13 EDT 1999 | Dave F

| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 02 12:52:40 EST 2002 | slthomas

We're trying a selective soldering pallet for the first time with mixed reviews. Are solder balls a prevalent problem with this process? Most of them seem to correspond with pallet wall locations....is it too much turbulence from the rotary chip wav

Temp Profile of E7501 and P64H2

Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj

Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks

Your opinion about RoHS and WEEE ?

Electronics Forum | Thu Dec 16 14:51:15 EST 2004 | blnorman

It's driven by those highly technically astute politicians in Europe. IPC has a lead-free forum you can subscribe to and almost to a person in the forum agrees that elimination of lead in solder is assinine. From the automotive end of electronics

Quad ZCR 941 and Lead Free?

Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton

Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be

80/20 Au/Sn Solder and Proper FLux Selection

Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet

All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker

Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a


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