Electronics Forum: thick (Page 8 of 276)

Au Thickness in ENIG PCB

Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare

0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare

HASL Plating Thickness

Electronics Forum | Tue Jul 27 07:06:59 EDT 2004 | davef

HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin * Our boards (from a major fab) average 500uin with an "as measured" range of 300-800uin Be careful

Conformal Coat Thickness

Electronics Forum | Mon Jul 23 17:49:04 EDT 2007 | davef

We know nothing of DeFelsko, but do understand how they distinguish between the solder mask and the conformal coat. DeFelsko manufactures hand-held, non-destructive coating thickness gages that are ideal for measuring the dry film thickness of confo

MLF / QFN Lead Free Shorting

Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit

Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"

Conformal Coat Thickness

Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef

NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.

SN100C Selective Solder Voiding

Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef

SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep

1oz Copper Sheet Specifications

Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef

First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat

2 oz Copper thickness??

Electronics Forum | Tue Apr 23 15:18:02 EDT 2013 | davef

2 oz copper should be 2 oz per ft^2 thick. There is no relationship between thickness and copper weight due to the effect of processing. Since this is a painful way of thinking about things, ppl have reached a compromise and talk about 'nominal thick

Thick film hydrids

Electronics Forum | Tue Oct 24 22:36:29 EDT 2000 | DL

On the main page of Smtnet towards the end of the opening paragraph states the following...Your " research continues in determining the reliability of thick film hybrid microcircuits and similar technologies using low-temperature, co-fired ceramics.

Printing problem, water soluble paste with gold plating PCB..

Electronics Forum | Mon Jul 30 18:52:43 EDT 2001 | Brian W.

You did not provide the stencil thickness or your aspect ratio. If your aspect ratio (Aperture width/stencil thickness) is less than 1.5, the paste will not release correctly from the aperture, leaving paste in the aperture. For example, if your pa


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