Used SMT Equipment | Pick and Place/Feeders
Equipment name: Fuji XP242E Fuji XP242E parameters Electronic board size: the maximum limit is: 457X356mm; the minimum limit is: 50X50mm Electronic board thickness: 0.3--4.0mm Component types: front side: up to 40 types; rear side: 10 types, 10 l
Used SMT Equipment | Pick and Place/Feeders
Brief Introduction of Equipment FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always h
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | Pick and Place/Feeders
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
Used SMT Equipment | Pick and Place/Feeders
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
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Used SMT Equipment | Pick and Place/Feeders
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100X parameters Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM) Board transfer direction right-left Mounting accuracy ±0.1m
Used SMT Equipment | Pick and Place/Feeders
Specifications *High speed placement at 0.165 sec / comp ( 21,800 cph) *On the fly vision *Fuji’s proprietary Multi-step (MS) vision processing Algorithm *Auto calibration *PCB Dimensions: Max: 508mm x 457mm Min: 80mm x 50mm Thickness
Used SMT Equipment | Pick and Place/Feeders
Specifications *PCB Dimensions: Max 457mm x 356 mm Min: 80mm x 50mm Thickness: 0.3 to 4.0 (including option) *Component Capacity: Feeders - 40 Types using 8mm tape feeders Trays - 10 types on 10 shelves *PCB loading time 4.2 sec. *Fuji X
