Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef
Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I
Electronics Forum | Wed Apr 11 08:36:23 EDT 2007 | davef
IPC-A-610D refers to 'toe down configuration' several times, beyond the 8.2.5.6 that you question. Although none will add to your understanding of 'toe down'. A lead that is 'toe down' is one where the foot of the lead is not parallel to the pad. T
Electronics Forum | Thu Dec 06 10:15:14 EST 2007 | 18424
I am looking for people that are having problems primarily with test of their product after reflow/production. Has anyone experienced a great solder joint but the component still fails test? Has anyone had dewetting of atmel components, pull back of
Electronics Forum | Tue Jan 30 09:26:59 EST 2007 | CK Flip
I think most people don't "get" soldering, and advocate the "more-is-better" approach as if solder were duct tape - you know...the more duct tape you put on something the stronger the bond. Such is NOT the case with soldering. People don't "get" that
Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower
Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently
Electronics Forum | Sat Jul 25 04:57:17 EDT 1998 | Stoney Tsai
| I have been building one sophisticated SMT soldering expert system (KBS), through my 8-YEARs SMT experience. As I know, in the marketplace only published some SMT raw material selection Expert System. | The system needs more technical information a
Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Mon Jul 07 13:33:40 EDT 2008 | realchunks
Most QFP 128s have a 0.16mm wide lead. Might have to modify your pads if you'r buying some odd ball part. But generally 0.2mm should be OK for this part. You may never get good toe wetting. Most QFPs are cut apart after plating, thus the toes are
