Electronics Forum | Thu May 20 19:29:18 EDT 2004 | Neil D. M.
Hi David, Can you send me a copy of this article "Reducing The Tombstoning of Small Discrete Components". Thanks a lot.
Electronics Forum | Thu Jul 15 14:01:15 EDT 2004 | nanref
WERW HAVING PROBLEM IN OUR PRODUCT SINCE WE STARTED USING A LEADFREE SOLDER PASTE..REJECTS OF TOMBSTONING IS SO ERRATIC...HOPE YOU CAN GIVE SOME INPUTS HOW TO CONTROL THIS..WHAT IS THE POSSIBLE CAUSE?THANKS
Electronics Forum | Thu Jul 15 15:37:29 EDT 2004 | davef
Get started by searching the fine SMTnet Archives. We love talking about tombstoning and solderballs. Good luck.
Electronics Forum | Thu Jun 02 14:50:41 EDT 2005 | techknow..
Placement looks good...paste to pad coverage good..correct profile used and verified by tracker. The problem being that this one cap is tombstoning at the same place every time. The placement is central. The part is near the edge at the break off.
Electronics Forum | Tue Jun 14 18:37:18 EDT 2005 | GS
On top to above suggestions,Round pad designe (where possible to get) helps to solve tombstoning pbm. Regards GS
Electronics Forum | Mon Jul 25 18:54:10 EDT 2005 | Brian
Exactly. We bring the paste apertures closer together, so that the part sits more in the center of the paste. As a CM, our customers do not always accept our recommended design changes, so we use this method to reduce our tombstoning if the pad geo
Electronics Forum | Fri Sep 09 09:58:54 EDT 2005 | gregcr
Hi all, we are placing some of the 0306's (0603 size parts with the contacts down the long side of the part rather than on the ends). We are having quite a lot of tombstoning. The placement is dead on and the pad layout is per the mfg specs'. Any
Electronics Forum | Fri Sep 09 11:01:14 EDT 2005 | rob
If the tombstoning is thermal (occuring during reflow) then try slightly reducing the stencil apertures so there is less the paste on the pads, reducing the forces acting on the component. Also take a look at the cooldown profile & making it more
Electronics Forum | Wed Jan 18 02:00:36 EST 2006 | pavel_murtishev
Good morning, This isn�t very strange. Bottom side components are prone to tombstoning more than topside ones. Try to reduce oven�s bottom heaters temperature slightly to prevent solder paste melting on bottom side. This can help. BR, Pavel
Electronics Forum | Wed Jan 18 11:26:16 EST 2006 | chunks
Hi Bjorn, Yes that can also add to tombstoning, but if maticulate your stencil to a high sanalot, you shouldn't see any tombstoing.
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