Full Site - : trays boards in reflow (Page 8 of 100)

BTU International and SMarTsol Engage in Service Agreement in Mexico

Industry News | 2014-04-02 16:05:40.0

BTU International, Inc.today announced that it has executed a service agreement with SMarTsol Technologies S. de R.L. de C.V. to supplement the company’s support infrastructure in Mexico.

BTU International

Europlacer Appoints Ste.Al.Tech in Italy.

Industry News | 2017-05-25 14:43:04.0

Blakell Europlacer is pleased to announce the appointment of Ste.Al.Tech Srl as its agent in Italy. The move further strengthens the company’s infrastructure in the region, adding to resources recently put in place with a direct Europlacer office in Italy extending its support into Slovenia, Serbia and Croatia.

EUROPLACER

4 working heads high precision pick and place machine with all in one electric feeder

4 working heads high precision pick and place machine with all in one electric feeder

New Equipment | Pick & Place

4 working heads high precision pick and place machine with all in one electric feeder Brief Introduction: NeoDen S1 is one of the NeoDen Smart Series Pick and place machine,it offers technologically advanced,low cost solutions for low to

NeoDen Tech Co.,Ltd.

Europlacer Appoints Giantec in Taiwan

Industry News | 2017-07-25 14:00:08.0

Award-winning Pick & Place equipment manufacturer, Europlacer, announces the appointment of Giantec Electronics Inc. as its exclusive distributor in Taiwan. Giantec is based in Taoyuan City and will distribute and support Europlacer’s flexible placement systems and intelligent Warehouse Management System (WMS) solutions, as well as the full range of automatic surface mount screen printing products from sister company, Speedprint Technologies. Giantec has been a leading distributor of semiconductor automation and SMT pcb assembly equipment in Taiwan since 1997.

EUROPLACER

Materials and Measurement in Brighton

Industry News | 2003-05-05 08:32:30.0

Nepcon UK in Brighton will host the latest in electronics materials and electronics reliability measurement equipment from Concoat.

Concoat Ltd.

RMD Instruments’ LeadTracer-RoHS XRF Tests RoHS Compliance in Solar Applications

Industry News | 2010-09-07 10:59:11.0

Devoted to the development of new radiation detector and systems technology, RMD Instruments Corp. announces that its innovative LeadTracer-RoHS XRF system now can be used in solar applications to ensure RoHS compliance.

RMD Instruments

Growth at Texcel Drives Investment in Two iineo+ Placement Machines.

Industry News | 2018-11-14 15:55:44.0

Dartford-based contract manufacturer Texcel Technology PLC has invested in two new iineo+ placement systems from Europlacer. The investment comes after a year of record growth for the firm and expanded production space to support that growth. It takes the number of SMT lines on the Texcel factory floor to seven.

Texcel Technology PLC

How to Manage Material Outgassing in Reflow Oven

Technical Library | 2020-11-24 23:12:27.0

In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.

Vitronics Soltec

europlacer iineo in action

europlacer iineo in action

Videos

europlacer iineo, flexible smt placer, in real production

EUROPLACER

Pin in Paste Stencil Design for Notebook Mainboard

Technical Library | 2008-03-18 12:36:31.0

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.

Vestel Electronic


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