Electronics Forum: unsolder (Page 8 of 12)

Reflow of 0402 capacitors

Electronics Forum | Thu Mar 08 12:40:54 EST 2001 | Ralph Merk

We are currently using 0402 resistors and capacitors in our production process. Our equipment is as follows: - DEK 265 - Siemens S25/F5 - Vitronics XPM520(5 zones) - 2% silver solder Alpha WS678 The problem is that randomly some 0402 capacitors are

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Tue Jun 12 20:59:14 EDT 2001 | ianchan

Hi mates, actually my whole problem, is whether to : 1) To offset the heat-absorb ability of the Pallet, that artifically lowers my pcba temperature, is it advisable to artifically increase the overall, oven zone temperatures? offset by estimated +

Manual Visual Inspection Benchmarks

Electronics Forum | Thu Jun 14 02:00:01 EDT 2001 | ianchan

Hi mate, AOI seems great for : 1) missing 2) wrong parts 3) wrong orientation 4) x-y axis misalignment 5) upside down placement 6) etc.....? AOI shucks for : 7) unsolder (joint) defect 8) tombstone / tilt My guys are evaluating AOI m/c, for substi

Re: Paste Printing @ 45 degrees

Electronics Forum | Fri Aug 13 13:38:23 EDT 1999 | Bian Wycoff

| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I have used thetechnique extensiv

Re: unsoldered joints

Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory

Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun

Micro Leadless Frame - solder wetting control

Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan

Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so

Immersion Silver

Electronics Forum | Wed Nov 06 20:18:30 EST 2002 | davef

cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see copper indicates you did no soldering, got no wetting, produced no intermetallics, etc. Tell us again which components did not solder? Wuzzis "plug" t

A.O.I - no salesman pitch pls

Electronics Forum | Tue Jun 10 20:31:55 EDT 2003 | iman

In a perfect world, the machines would be maint."guys" for the automation machines. Think "closed loop" system. Anyway, getting back to our reality job, we are still game for automation to improve thru'put, quality, reduce problems. The focus here

Copper oxide

Electronics Forum | Thu Jul 31 11:33:51 EDT 2003 | yngwie

I faced problem over connecter's pin that were hot air soldered. This connector has 168 pins ( similar to the straddle connector ). The process is to apply the flux onto the connector's J-leads, and the hot air pencil were then ran thru' the leads to

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny

Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera


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