Electronics Forum | Thu Aug 12 00:02:29 EDT 1999 | dean
| We currently have 32 LEDs per board and are looking to change the LED from a gull wing package to another package. (possibly a chip type package). I have heard that some cases and LEDs do not like reflow. This part is not cost effective to have to
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Mon Jun 05 15:33:41 EDT 2017 | deanm
Rick, You might want to consider a Quad 4000C. Even though Quad is out of business, parts and support are available from Precision Placement Machines. They are rebuilt with a warranty and run Windows 7. They offer intelligent feeders and if you don'
Electronics Forum | Thu Aug 24 09:23:29 EDT 2000 | Dr. Ning-Cheng Lee
You are asking a very good question which has been an issue in the industry for a long long time. For operating at 225C, you will need a solder with melting point no lower than 270 or even 280C. HMP solder is very difficult to come by. At this stage,
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Wed Sep 08 17:02:39 EDT 1999 | Carol Zhang
| | | Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years.
Electronics Forum | Wed Apr 10 10:32:39 EDT 2002 | slthomas
Ask your compadres how you can control a process when it's output has already been completed? If you do second side assembly before you inspect the first side, you can't possibly apply real time corrective action. I know what I'm talking about in t
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
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