Electronics Forum | Tue Nov 07 22:05:23 EST 2006 | Jerry Butters
Which fixture material is LEAST LIKELY to warp? Please advise. We used ta have a Wave Optimizer but the corpulent engineer before me broke it before he left the company. Anywho, my next project is to design a wave fixture pallet which will work
Electronics Forum | Mon Oct 31 19:37:16 EDT 2022 | emeto
Just because you can't add copper to the board, doesn't mean you can't add copper to the panel. Redesign panel, where board house can add copper to the panel to balance the board a little better. I would advise against low melting solder alloys on cu
Electronics Forum | Mon Jan 09 11:34:40 EST 2023 | tommy_magyar
How big is the board? What is the thickness? How populated is it? Is it warping in the reflow oven? If yes, does the oven have any support? How big is the pad compared to the component footprint? How thick is the stencil? Are the components checked b
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Wed Jun 03 09:04:19 EDT 1998 | Steve Gregory
Hi Anthony! Earl's right, things can get rather involved when you start discussing ALL the things that affect whether or not a board is going to warp. The way I look at the issue is try to separate the warp issue into two catagories; 1. The board bei
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
Electronics Forum | Tue Aug 08 20:43:41 EDT 2000 | Dave F
Tom: So is warp or is it twist? They�re different problems, possibly with different sources!!! And possibly different solutions!!! Consultants to talk to are: Earl Moon (pod@vcn.com), Werner Engelmeyer (engelmaier@aol.com), Les Hymes (les.hymes@w
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
Electronics Forum | Thu Jun 25 10:32:51 EDT 1998 | Gary Simbulan
Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handboo
Electronics Forum | Mon Mar 16 04:46:25 EST 1998 | Grant Petty
We have just go another batch of PCB's from our loaders, and some of the boards are severely warped. The boards are PCI cards and one of the boards is 9mm out at one end. The PCB is 210mm long and 4 layers. I am wondering if anyone knows what could
.gif)
