Electronics Forum | Tue Dec 09 19:04:54 EST 2008 | gregoryyork
you need to check your angle on this, can you measure and advise what you have cheers Greg York
Electronics Forum | Wed Aug 30 09:56:37 EDT 2000 | NLykus
Hi Ramon, We have had this problem before on our Seho Wave Solder Machine. We are currently using a spray fluxer as well. By imersing the PCB into the flux you stated you are getting good results. What you need to do is check your spray patter
Electronics Forum | Fri Jun 25 15:04:39 EDT 2010 | siddharth
Thanks for you suggestions, guys. davef, I am gonna get with my PCB suppliers and talk to them about copper balancing and checking the Tg of the materials they use. SC, I am working towards designing wave pallets for my boards and try your suggesti
Electronics Forum | Thu Oct 07 06:02:38 EDT 1999 | Wolfgang Busko
| | | | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life
Electronics Forum | Wed Mar 28 14:11:19 EDT 2007 | pjc
It should only be a visual thing. What may be happening is that all the thermal energy being driven into the wave solder pallet to get good soldering is causing the no-clean residues to burn up a bit, causing the discoloring. Check to see if they hav
Electronics Forum | Sat Jan 29 05:43:51 EST 2005 | Chua
Hi Chunks, Thanks for your input. Appreciate you could send me a copy of your evaluation list as this type of evaluation is new to me..... Here is my email address :- pgchua@cyberway.com.sg Thanks.
Electronics Forum | Fri Sep 14 12:32:25 EDT 2012 | mark25y2001
just check if the pad and component terminal was traces of solder, if have? try to reduce preheat temp and solder bath temp... reason why solder not adhere because of component lead type, if more heat you apply solder flows and not completely adhere.
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Wed Aug 11 07:41:52 EDT 2004 | gregoryyork
Check cure of solder resist. Use a No clean low solids rosin flux this will stop problem. Should see almost zero solder balls if put through a single wave compared to a dual wave. If this is true then it is a resist issue and cannot 'resist' the sold
