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Demand for custom nozzles and grippers is on the rise Placing exotic components fast and reliably

Industry News | 2012-09-13 06:59:37.0

ASM Assembly Systemsexperiences rising demand for custom-designed nozzles, grippers and feeders.

ASM Assembly Systems GmbH & Co. KG

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Technical Library | 2015-12-02 18:32:50.0

(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.

Altera Corporation

Air purification and occupational health & safety in electronics production

Technical Library | 2021-04-16 05:38:38.0

The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently.

ULT Canada Sales Incorporated

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Technical Library | 2021-05-13 16:03:25.0

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed

University of Seoul

New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications

Industry News | 2012-03-30 18:48:18.0

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

EMS TECHNOLOGY, INC.

Nordson DAGE Expands into New Research and Development Facility Increased investment to support new product developments and innovation in Test and Inspection

Industry News | 2014-03-04 16:16:46.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the official opening of its new expanded Research and Development facility in Colchester, Essex, UK.

Nordson DAGE

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)

TG-1000 Hotbar Bonding System for Small Displays and Wearable Products

Industry News | 2017-05-26 14:54:11.0

Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning

Toddco3

Hesse Mechatronics

Industry Directory | Manufacturer

Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.


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