Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto
Very interesting. Looking at the wire bonding, it seems that it is all normal.
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Tue Sep 13 10:00:27 EDT 2016 | awhite
Switched out the mech. relay on the board loader, no change. Same behavior. Could not find a mech. relay on the printer... SMEMA wiring appears go directly to a PCB. And it is at that point that I run out of talent. If the machine weren't dedicate
Electronics Forum | Thu Mar 31 12:13:28 EDT 2022 | cbart
That is a tough one because of package size I agree, as noted previously it would be good to know what the current PCB pad layout is. first thought does go right to an adapter board of course! is this a volume build or just 20-50 pcs? dead bug and ha
Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul
Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi
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