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Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 13:54:30 EST 1999 | John

| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 17:18:22 EST 1999 | Earl Moon

| | Hi folks, | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and

Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 20:08:34 EST 1999 | Steve Gregory

Are you suggesting there may be some chemical incompatibility between paste/flux chemistries and the glue being used - thus intefering with the glue's ability to bond properly? I've only heard of this possibility, but never experienced it. Justin, St

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi

Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side

Re: Batch reflow oven

Electronics Forum | Tue Mar 16 19:25:32 EST 1999 | Earl Moon

| | Looking for a company that makes a small batch reflow oven. Not a belt-style convection oven, but a cabinet style that can 125 c to 150 c. | | | | Thank you | | | TRY GE I HAVE ONE AT HOME THAT COOKES PRETY DARN GOOD. And it will get hotter if

Re: Batch reflow oven

Electronics Forum | Tue Mar 16 20:09:01 EST 1999 | Wayne Bracy

| | | Looking for a company that makes a small batch reflow oven. Not a belt-style convection oven, but a cabinet style that can 125 c to 150 c. | | | | | | Thank you | | | | | TRY GE I HAVE ONE AT HOME THAT COOKES PRETY DARN GOOD. And it will get

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 17:14:49 EST 1999 | Michael Allen

Another test to consider is dye penetrant analysis. The technique involves flooding the area beneath the soldered part with dye (preferably a bright color, like red). After drying the board+dye in an oven, you peel or torque the part off and inspec

Re: Suspect BGAs

Electronics Forum | Sat Mar 20 00:33:28 EST 1999 | Mike C

| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it

Re: Stencils Universal?

Electronics Forum | Tue Mar 16 14:37:42 EST 1999 | Steve Gregory

Hi Nancy! Just as Steve and Dean said, most printers have some sort of restrictions of what frame, where the image is positioned, ect. before the stencil will work in the printer. The two manufacturers that I'm most familiar with DEK and MPM do have

Re: Stencils Universal?

Electronics Forum | Tue Mar 16 20:17:13 EST 1999 | Chris G.

| Are stencils universal from one printer to another? We are looking into the possibility of going from Solderprint 1414 manual printer to a more automated printer. We are also considering bringing some boards we currently outsource in house. I w


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