Electronics Forum | Wed Aug 02 03:25:17 EDT 2000 | wpeng
Thank you for your email. If you have any updated information on lead-free issues, please inform me. My Address is Mrs. Weiqun Peng Electronics/Hardware Integration Nokia Research Center Itamerenkatu 11 - 13 FIN-00180 Helsinki Finland Mobile: +358
Electronics Forum | Sat May 27 14:13:35 EDT 2000 | Madan Mohan
Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compare
Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee
Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p
Electronics Forum | Thu Jul 20 14:16:42 EDT 2000 | Bob Willis
Only used adhesives once and it was a disaster. I don�t rearly have much experience but the real problem is everyone wants to compare adhesive with solder and they will not give the same results. There is a good book on adhesive check out my book re
Electronics Forum | Thu Jul 20 12:56:45 EDT 2000 | Bob Willis
That�s a good question which I will leave to others to debate further. I feel that there will be a need to examine and understand all the issues with lead-free and have as many practical solution as possible ready rather than waiting. There are sti
Electronics Forum | Thu Jul 20 12:36:04 EDT 2000 | Mike McMonagle
The EU recently announced that the WEEE directive proposal for lead-free assembly in Europe has been adopted, but the implementation date has been moved from 2004 to 2008. What do you feel was the driving force behind this change, and do you feel tha
Electronics Forum | Thu Jul 20 12:11:28 EDT 2000 | Mike McMonagle
There are many challenges facing the assembly industry today such as: - Lead-free assembly and other environmental concerns - Continued shrinkage of active and discrete components - �New� alternate fab finishes such as immersion tin and silver - The
Electronics Forum | Sun May 12 22:01:44 EDT 2002 | ianchan
Hi mates, since I read about this immersion Ag plated PCB, was wondering if its so damm good, why so few people are using it? and why so long to market its PCBA application-virtues? feedback from bouncing this question around is Ag is prone to corr
Electronics Forum | Thu May 30 20:09:58 EDT 2002 | myu
Thank you very much, Dave and Steve. I got paste and wire from Indium and Qualitek. Are there anybody with high-temperature reflow experience (330 degree C)? Is it OK to use Regular Convection Reflow Oven (We have a Conceptronic HVC 70, 5 zones) ?
Electronics Forum | Fri Jun 07 02:43:35 EDT 2002 | madreindeer
Thanks for answers....In Euroland (My place)it is not so clear.And this is confusing: There is 3 different comittee�s in Europe. First says 1 of January 2007.Second says 1 of January 2006, and third one says that any of these will do. Also we get a
